Telos OBC

To overcome hurdles associated with our own pursuits, we developed the most powerful compute platform, for both single- and double-precision operations, compatible with nanosatellites. The entry-level Telos OBC is 6x more powerful than the current state-of-the-art. It utilises bleeding-edge FPGA technologies otherwise unavailable to the sector. If you need some serious processing-punch, this is the best you’re going to find.

Telos is a one-step solution for a variety of advanced compute applications such as:

Signal/image processing systems

AI & Machine Learning

Constellation Management

Key points:

Reliability, fault tolerance and SEU protection are improved though TMR and EDAC on data and logic.

Supplied with OrbAstro flight software or a Linux platform to accelerate applications development (no embedded systems or space electronics expertise required).

Based on Xilinx Ultrascale+ MPSoCs with ARM cortex A53 and R5 64-bit processing cores, combined with LPDDR4 memory.

Mechanical and electrical interfaces are customisable with external docks; compatible with PC-104 CubeSat standard.

Supports CV and ANN.

To clarify the value proposition for your mission, get in touch: hello@orbastro.com. We will be ready to ship qualified products from late Q2 2020 onwards.

Variants of Telos OBC available:

Spec

Telos 10 series

Telos 40 series

Telos 60 series

A53

Dual core @ 1.3GHz

Quad core @ 1.5GHz

Quad core @ 1.5GHz

R5

Dual core @ 0.5GHz

Dual core @ 0.6GHz

Dual core @ 0.6GHz

FPGA

0.24 – 3.1K DSP blocks, 100k – 730k Logic cells

0.24 – 3.1K DSP blocks, 100k – 730k Logic cells

1.9 – 21.3K DSP blocks, 747k – 6451k Logic cells

DRAM

Up to 4GB (EDAC)

Up to 8GB (EDAC)

Up to 64GB (EDAC)

Peak Performance

1 TFLOPs

1 – 5 TFLOPs

3 – 15 TFLOPs

Max DRAM data rate

>9GB/s

>9GB/s

>>200GB/s

Flash

32GB (EDAC)

32GB (EDAC)

128GB (EDAC)

General Interfaces

4xI2C Master/slave, 4xSPI Master/slave, 4xRS422/RS485, 2x CAN

4xI2C Master/slave, 4xSPI Master/slave, 4xRS422/RS485, 4x CAN

4xI2C Master/slave, 4xSPI Master/slave, 4xRS422/RS485, 4x CAN

High Speed Interfaces

Up to 40x LVDS @ 1.2Gbps, 4x PCIe G2,
up to 16x Gigabit Transceivers @ 32Gbps

Up to 40x LVDS @ 1.2Gbps, 4x PCIe G2,
up to 16x Gigabit Transceivers @ 32Gbps

40x LVDS @ 1.2Gbps, 4x PCIe G3, 40x Gigabit Transceivers @ 32Gbps

Radiation Tolerance

>400krad (TiD)*, SEU protection on DRAM and Flash

>400krad (TiD)*, SEU protection on DRAM and Flash

>400krad (TiD)*, SEU protection on DRAM and Flash

Operating Temp. Range

-30°C to +60°C

-30°C to +60°C

-30°C to +60°C

Survival Temp. Range

-40°C to +100°C

-40°C to +100°C

-40°C to +100°C

Operating Voltage

5 – 60V

5 – 60V

5 – 60V

Power Consumption

0.2 – 12W

0.2 – 12W

0.4 – 40W

Mass

60g (120g with heat sink)

60g (120g with heat sink)

80g (155g with heat sink)

Dimensions

80x45x10mm (without redundancy)

80x45x10mm (without redundancy)

80x80x10mm (without redundancy)

Redundancy

Dual Redundant (optional)

Dual Redundant (optional)

Dual Redundant (optional)

*Estimated values; testing in Q2/Q3 2020.

Comparison against state-of-the-art:

Spec

OrbAstro Telos 10 series

Zynq 7030 Architecture

ARM Cortex M7 Architecture

Speed

750x

125x

1x (baseline)

Benchmark Algorithm

Time (μs)**

0.176

1.053

131.425

Max Power Consumption

2W

2.2W

0.25W

RAM

LPDDR4

(4GB baseline,

up to 32GB on request)

DDR3

(1GB)

DRAM

(2MB)

Size

80x45x10mm

65x40x7mm

95x95x12mm

Mass

60g

77g

60g

**We measured the compute time for each system to process a complex orbital dynamics algorithm.

Get in touch: hello@orbastro.com